PROUD SA

To tackle the problem of heat management, we have invented an innovative method allowing epitaxial deposition of high-quality diamond directly on foreign substrates without any interlayer. Our diamond layer, with the highest heat dissipation capacity of any existing material, deposited on chips from manufacturers and foundries allows a direct upgrade in heat extraction, output power and efficiency. Thus, thanks to our patented technology, our high-quality diamond can be directly integrated onto low-cost semiconductor substrate (such as silicon). Our diamond-based solutions aims to unleash the full power of the new generation of chips developed for AI and quantum computing without disruption of the value chain of our customers.